Asahi Kasei Develops Novel Photosensitive Polyimide Film for Advanced Panel-Level Semiconductor Packaging
TOKYO – May 21, 2026 – Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response to these market changes, Asahi Kasei, a diversified global company, has combined the features of its photosensitive polyimide (PSPI) and dry film photoresist (DFR) into a new photosensitive film. The PSPI film is currently under customer evaluation, with commercial availability expected in the near future. The new PSPI film was developed by combining Asahi Kasei“s expertise in the manufacture…
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