Global High Speed Serial Switch Fabrics Market Status and Prospect, Forecast 2018 to 2026
High speed serial switch fabrics is a system for linking devices together to support many simultaneous data transfers usually implemented with a crossbar switch. Data is sent in packets with information contained in the packet header for identification, routing and error detection, and correction. High speed switches serial fabrics provide a method to switch the packets from input ports to output ports. However, the two possible locations for buffering are at the input of the switch fabric or shared memory and also control the quality of service.
Low installation costs, easier maintenance of data transfer networks, low numbers of small connectors, cables and signal lines are key factors driving growth of the global high-speed serial switch fabrics market. In addition, product innovation, development, and increase in use of cloud computing are some other factors boosting growth of the global high-speed serial switch fabrics market during forecast period.
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Traffic management interaction is key factor to hamper growth of the global high-speed serial switch fabrics market. Also, backplane interfacing is other factor to restrict growth of the global high-speed serial switch fabrics market during forecast period.
The global high-speed serial switch fabrics market is segmented on the basis of product, application, and region.
North America accounts for largest revenue contribution to the global high-speed serial switch fabrics market. This is attributed to the presence of key manufacturers followed by high adoption rate of switched fabric configuration in the region. However, the Asia Pacific market is projected to register highest CAGR in terms of revenue during the forecast period due to increased usage of high speed switches by various semiconductor industries.
Key player profiled in the global high speed switch fabrics market include Pentek Inc., Microsemi Corporation, Cisco Systems Inc., Broadcom Corporation, Sierra Wireless, Curtiss-Wright Corporation, Intel Corporation, Integrated Device Technology Inc., and Macom.
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